4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Patrick R. Morrow

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3D integrated circuits using thick metal for backside...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Forming ultra dense 3-D interconnect structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3157942

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