Apparatus for encapsulating electronic packages

Details Apparatus for encapsulating electronic packages Apparatus for encapsulating electronic packages

1996-10-16

1998-07-07

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425544, 425DIG228, 26427217, 264275, 249 91, 249 95, B29C 4502, B29C 4514

Patent

active

057765120

ABSTRACT:
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4437141 (1984-03-01), Prokop
patent: 4455274 (1984-06-01), Horney
patent: 4460537 (1984-07-01), Heinle
patent: 4470786 (1984-09-01), Sano et al.
patent: 4688152 (1987-08-01), Chia
patent: 4778641 (1988-10-01), Chia
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4859722 (1989-08-01), Shiobara et al.
patent: 4861251 (1989-08-01), Moitzger
patent: 4868349 (1989-09-01), Chia
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4935581 (1990-06-01), Komathu
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5049526 (1991-09-01), McShane et al.
patent: 5093282 (1992-03-01), Ohno et al.
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5132778 (1992-07-01), Juskey et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5191511 (1993-03-01), Sawaya
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5328870 (1994-07-01), Marrs
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5370517 (1994-12-01), Casati et al.
patent: 5395226 (1995-03-01), Sakai et al.
patent: 5609889 (1997-03-01), Weber
E. Stephans, "Pinless Module Connector," IBM Technical Disclosure Bulletin, vol. , No. 10:3872 (Mar. 1978).
Moore et al., "Solder Joint Reliability of Fine Pitch Solder Bumped Pad Array Carriers," pp. 264-274.

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