4. Metal fusion bonding
  5. Process
  6. With condition responsive, program, or timing control

Orthodyne Electronics Corporation

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Articulated wire bonder

Metal fusion bonding – Process – Plural joints
Patent

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Automated filament attachment system for vacuum fluorescent...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate

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Die sorter with reduced mean time to convert

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Reexamination Certificate

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Dual mode ultrasonic generator in a wire bonding apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Integrated circuit package system including ribbon bond...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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