Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-11-09
2008-10-28
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S688000, C257S698000, C257S784000, C257S786000
Reexamination Certificate
active
07443018
ABSTRACT:
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
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Ahmad Mohd Helmy Bin
Chung Kwang Yong
Luechinger Christoph B.
Ong You Yang
Wong Garrett L.
Ishimaru Mikio
Orthodyne Electronics Corporation
Soward Ida M
Stats Chippac Ltd.
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