Articulated wire bonder

Metal fusion bonding – Process – Plural joints

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Details

228 11, 228102, H01L 21607

Patent

active

058683003

ABSTRACT:
A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one stepper motor. A processing unit is mounted on the bonding head for controlling the clamping, feeding, and breaking of the wire.

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IBM Technical Disclosure Bulletin Entitled Cutting Fine Lead Wires After Ultrasonic Bonding --By B. w. Miller --vol. 10 No. 3 Aug. 1967.
IBM Technical Disclosure Bulletin Entitled Ultrasonic Bonding Tip --By V.T. Ho and S.E. Nichols, Jr. --vol. 10 No. 12 May 1968.

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