Resin sealing type semiconductor device

Details Resin sealing type semiconductor device Resin sealing type semiconductor device

1997-12-15

1999-12-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361783, 361813, 257684, 257730, 257737, 257738, 257786, 257787, 174 521, 174 522, 174 523, 174 524, 174260, 438127, H01L 2348, H01L 2310

Patent

active

059994134

ABSTRACT:
A resin sealing type semiconductor device capable of making a resin burr hard to occur when formed by molds and of restraining cracks in solder, is actualized by providing a stepped portion on a resin sealing body for covering a circuit forming surface of a semiconductor chip, making leads exposed from this exposed surface and joining solder bumps to the leads.

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