4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Norbert Seliger

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Arrangement for subjecting a bonding wire to a mechanical load

Measuring and testing – Dynamometers – Responsive to force
Reexamination Certificate

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Connection technology for power semiconductors comprising a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Device having a contacting structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Device with power semiconductor components for controlling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electrical component on a substrate and method for...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-2424592

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