Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Fe-Ni based alloy
Getter material and evaporable getter device using the same,...
IC package and LSI package using a lead frame formed of a copper
Lead frame formed of a copper-zirconium alloy
Lead frame with improved adhesiveness property against plastic a
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Profile ID: LFUS-PAI-P-734423