Method, system, and apparatus for gravity assisted chip...

Details Method, system, and apparatus for gravity assisted chip... Method, system, and apparatus for gravity assisted chip...

2006-03-13

2008-08-12

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23021, C438S613000

Reexamination Certificate

active

07411296

ABSTRACT:
A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist opening in resist material disposed on a surface of the bump metal and adjacent the interconnect metal. The resist opening may be wider at an open end thereof than at an end in contact with the interconnect metal.

REFERENCES:
patent: 2004/0127009 (2004-07-01), Chen et al.
patent: 2006/0105560 (2006-05-01), Tseng et al.

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