4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Pretreatment of substrate or post-treatment of coated substrate

Nerissa Taylor

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ALD of tantalum using a hydride reducing agent

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Methods of forming tungsten nucleation layer

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
Reexamination Certificate

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Selective refractory metal and nitride capping

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Selective refractory metal and nitride capping

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Sequential electron induced chemical vapor deposition

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2307146

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