4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Naoyuki Komuta

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Stacked electronic component and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Stacked electronic component and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2237629

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