Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-05-19
2009-12-08
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257S690000, C257S702000, C257S725000, C257S738000, C257S783000, C257S784000, C257S793000, C257SE25027, C257SE23119, C257SE23127, C438S109000, C438S118000, C438S126000, C438S127000
Reexamination Certificate
active
07629695
ABSTRACT:
A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
REFERENCES:
patent: 5220200 (1993-06-01), Blanton
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6333562 (2001-12-01), Lin
patent: 6352879 (2002-03-01), Fukui et al.
patent: 6353263 (2002-03-01), Dotta et al.
patent: 6657290 (2003-12-01), Fukui et al.
patent: 2002/0024127 (2002-02-01), Sakuraba et al.
patent: 2002/0089067 (2002-07-01), Crane et al.
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2003/0042615 (2003-03-01), Jiang et al.
patent: 2003/0047813 (2003-03-01), Goller et al.
patent: 2003/0189259 (2003-10-01), Kurita et al.
patent: 2004/0007782 (2004-01-01), Hedler et al.
patent: 2005/0046005 (2005-03-01), Bowen
patent: 2005/0205981 (2005-09-01), Yoshimura et al.
patent: 1270417 (2000-10-01), None
patent: 08-288455 (1996-11-01), None
patent: 2000-144072 (2000-05-01), None
patent: 2001-217384 (2001-08-01), None
patent: 2002-222913 (2002-08-01), None
patent: 2003-179200 (2003-06-01), None
patent: 2003-218316 (2003-07-01), None
patent: 2004-072009 (2004-03-01), None
patent: 2004-193363 (2004-07-01), None
Yoshimura, et al., “Stacked Electronic Part”, U.S. Appl. No. 11/081,596, filed Mar. 17, 2005.
Office Action dated Jun. 7, 2007, from the Chinese Patent Office for corresponding application No. 200510070829X.
Office Action dated Feb. 26, 2008 in counterpart Japanese Patent Application No. 2005-126443.
Office Action issued by the Chinese Patent Office on May 22, 2009, for Chinese Patent Application No. 2008101097899, and English-language translation thereof.
Komuta Naoyuki
Numata Hideo
Yoshimura Atsushi
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Ho Hoang-Quan T
Huynh Andy
Kabushiki Kaisha Toshiba
LandOfFree
Stacked electronic component and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked electronic component and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked electronic component and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4098329