4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Naoto Takebe

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Molded packaging for semiconductor device and method of manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Molded packaging for semiconductor device and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1762763

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