4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Outside periphery of package having specified shape or...

Myeong Jin Shin

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Semiconductor chip package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Semiconductor chip package and method for fabricating the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1819238

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