Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
Inventor
active
Leadframe and semiconductor package with improved solder...
Method for making a semiconductor package having improved...
Semiconductor device having increased moisture path and...
Semiconductor package having reduced thickness
Semiconductor package having reduced thickness
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Profile ID: LFUS-PAI-P-2367149