4. Metal fusion bonding
  5. With control means responsive to sensed condition

Mitsunori Tamura

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Method for forming conductive bumps

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method of fabricating an electronic circuit device

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent

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Multichip module with heat sink and attachment means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Process for manufacturing electronic circuits

Metal fusion bonding – With control means responsive to sensed condition
Patent

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Process for manufacturing electronic circuits

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Profile ID: LFUS-PAI-P-459108

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