Method of fabricating an electronic circuit device

Details Method of fabricating an electronic circuit device Method of fabricating an electronic circuit device

1996-12-06

1999-02-02

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

22818022, H05K 334

Patent

active

058653651

ABSTRACT:
A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

REFERENCES:
patent: 5129962 (1992-07-01), Gutierrez et al.
patent: 5564617 (1996-10-01), Degani et al.
patent: 5616164 (1997-04-01), Ochiai et al.

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