Method for forming conductive bumps

Metal working – Method of mechanical manufacture – Electrical device making

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29423, 22818022, H05K 300

Patent

active

055511481

ABSTRACT:
A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that they are joined and transferred to the pad patterns on the circuit board, and the film-like member is then removed by heating or cleaning liquid.

REFERENCES:
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5116228 (1992-05-01), Kabeshita et al.
Denshi Zairyo, Nov. 1992, pp. 28-35.
Nikkei Electronics, Feb. 17, 1992, pp. 104-105.
IBM TDB vol. 32, No. 6B, Nov. 1989.
IBM Technical Disclosure Bulletin, Ball and Chip Placement Wafer, vol. 30, No. 7, Dec. 1987, pp. 124-125.

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