4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough

Mitsuhiro Takayama

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Composite multi-layer substrate and module using the substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Composite multi-layer substrate and module using the substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Composite multi-layer substrate and module using the substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Composite multi-layer substrate and module using the substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Multilayer printed wiring board and production method therefor

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2334039

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