Composite multi-layer substrate and module using the substrate

Details Composite multi-layer substrate and module using the substrate Composite multi-layer substrate and module using the substrate

2008-03-25

2008-03-25

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257SE23064, C257S707000, C257S724000

Reexamination Certificate

active

10515953

ABSTRACT:
A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

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International Search Report in English mailed Aug. 26, 2003 with Japanese version of International Search Report.

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