Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-10-09
2007-10-09
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S852000
Reexamination Certificate
active
10525037
ABSTRACT:
A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) for electrically connecting between conductor circuits on the base layer or adjacent layers are formed. The via holes are formed by patterning metal foil with conductivity. The height “H” of the via holes (dimension in the thickness direction of the via hole forming layer) depends on the thickness “D” of the original metal foil only. Accordingly, the via holes can be formed without carrying out filling with conductive paste or electrolytic plating. Thus, multilayer PWB having via holes with satisfactory quality without defective shapes like swelling or recession on the end faces can be manufactured.
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Notice Informing The Applicant Of The communication Of the International Application To the Designated Offices mailed Feb. 26, 2004.
English translation of JP Patent Publication No. 10-022639 to Teiichi et al. Japanese Document Published Jan. 23, 1998.
Miyazaki Masashi
Murota Takatoshi
Sawatari Tatsuro
Takayama Mitsuhiro
Arbes Carl J.
Blank Rome LLP
Taiyo Yuden Co. Ltd.
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