Semiconductor device wherein chips are stacked to have a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S685000, C257S777000, C257S778000, C257S723000, C257S712000, C257S704000, C257S532000, C257S728000, C257S725000, C257S724000, C257S528000, C257S720000

Reexamination Certificate

active

06897552

ABSTRACT:
There is here disclosed a semiconductor device comprising a chip-mounting-member having a lead formed on its major surface, the lead having a thin film plated portion which covers a surface of a predetermined portion of the lead, a semiconductor chip having a bump formed on its major surface, and mounted on the chip-mounting-member by electrically connecting the bump to the lead via the plated portion, and an encapsulating-member formed between the semiconductor chip and the chip-mounting-member.

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