Manufacturing method for solid state image pickup device

Details Manufacturing method for solid state image pickup device Manufacturing method for solid state image pickup device

2011-04-26

2011-04-26

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S071000, C438S066000, C257S294000, C257SE31121, C257SE31123

Reexamination Certificate

active

07932122

ABSTRACT:
A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method includes successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by dry etching, and the rest of the plurality of the color filter pattern is formed by photolithography.

REFERENCES:
patent: 5719074 (1998-02-01), Hawkins et al.
patent: 5994721 (1999-11-01), Zhong et al.
patent: 6566151 (2003-05-01), Yeh et al.
patent: 7736939 (2010-06-01), Wu et al.
patent: 2004/0164672 (2004-08-01), Kawaguchi et al.
patent: 2005/0128509 (2005-06-01), Tokkonen et al.
patent: 2008/0265349 (2008-10-01), Kasano et al.
patent: 63-188104 (1988-08-01), None
patent: 64-2002 (1989-01-01), None
patent: 2-15201 (1990-01-01), None
patent: 5-27117 (1993-02-01), None
patent: 6-289217 (1994-10-01), None
patent: 11-68076 (1999-03-01), None
patent: 2004-228398 (2004-08-01), None
patent: 2004-335598 (2004-11-01), None
U.S. Appl. No. 11/889,070, filed Aug. 8, 2007, Keisuke Ogata et al., Toppan Printing Co., Ltd.
International Search Report issued Apr. 11, 2006 in corresponding PCT Application No. PCT/JP2006/302061 (4 pp).
International Preliminary Examination Report issued Apr. 18, 2006 in corresponding PCT Application No. PCT/JP2006/302061 (4 pp).
International Preliminary Report on Patentability issued in corresponding International Application No. PCT/JP2006/302061, mailed on Aug. 23, 2007.
Taiwanese Office Action issued on Nov. 26, 2008 in corresponding Taiwanese Patent Application 09720647950.
Restriction Requirement mailed from the Unites States Patent and Trademark Office on Nov. 3, 2009 in the related U.S. Appl. No. 11/889,070.
Office Action mailed from the Unites States Patent and Trademark Office on Jan. 13, 2010 in the related U.S. Appl. No. 11/889,070.
U.S. Office Action mailed Jun. 30, 2010 in U.S. Appl. No. 11/889,070 (6 pages).

Affiliated with

Also associated with

Rating

Manufacturing method for solid state image pickup device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for solid state image pickup device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for solid state image pickup device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2711663