4. Metal fusion bonding
  5. With control means responsive to sensed condition

Mitsugu Shirai

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Electronic device bonding method and electronic circuit apparatu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Laser printing method and apparatus

Incremental printing of symbolic information – Light or beam marking apparatus or processes – Scan of light
Reexamination Certificate

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Laser printing method and apparatus for printing characters

Incremental printing of symbolic information – Light or beam marking apparatus or processes – Scan of light
Reexamination Certificate

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Method for forming conductive bumps

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Paste providing method, soldering method and apparatus and...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-459107

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