Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1997-08-25
1999-10-26
Everhart, Caridad
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257737, 438613, 438612, H01L 2348
Patent
active
059734060
ABSTRACT:
An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.
REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 4379218 (1983-04-01), Grebe et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4732312 (1988-03-01), Kennedy et al.
patent: 5188280 (1993-02-01), Nakao et al.
patent: 5246880 (1993-09-01), Rule et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5616517 (1997-04-01), Wen et al.
patent: 5712192 (1998-01-01), Lewis et al.
1st Symposium "Microjoining and Assembly Technology in Electronics", Feb. 9-10, 1995, pp. 187-192.
Harada Masahide
Nishikawa Toru
Satoh Ryohei
Shirai Mitsugu
Uda Takayuki
Everhart Caridad
Hitachi , Ltd.
LandOfFree
Electronic device bonding method and electronic circuit apparatu does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device bonding method and electronic circuit apparatu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device bonding method and electronic circuit apparatu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-768021