4. Electricity: measuring and testing
  5. Impedance, admittance or other quantities representative of...
  6. Lumped type parameters

Ming-Yi Lay

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Metal bump with an insulating sidewall and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Metal bump with an insulating sidewall and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Test device and method

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2556161

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