4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Ming-Wei Lin

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Method to improve planarity of electroplated copper

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Uniform current distribution for ECP loading of wafers

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3014680

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