Uniform current distribution for ECP loading of wafers

Details Uniform current distribution for ECP loading of wafers Uniform current distribution for ECP loading of wafers

2005-04-28

2009-06-09

Bell, Bruce F (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Controlling current distribution within bath

C205S123000, C205S137000, C205S157000, C205S167000

Reexamination Certificate

active

07544281

ABSTRACT:
An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The apparatus includes a bath container for containing a bath solution, an anode provided in the bath container, a cathode ring for supporting a wafer in the bath container and a current source electrically connected to the anode and the cathode ring. According to the method, a voltage potential is applied to the cathode ring as it is immersed into the solution and prior to immersion of the wafer in the solution, thereby facilitating a substantially uniform plating current across the wafer upon immersion of the wafer.

REFERENCES:
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 7285195 (2007-10-01), Herchen et al.
patent: 2002/0029962 (2002-03-01), Stevens et al.
patent: 2003/0150715 (2003-08-01), Yahalom et al.
patent: 2004/0140203 (2004-07-01), Burkhart et al.

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