Method of solder removal

Details Method of solder removal Method of solder removal

1997-11-04

1999-06-08

Ryan, Patrick

Metal fusion bonding

Process

With removing or reshaping of filler material or flash after...

228 19, 228264, B23K 1018

Patent

active

059098384

ABSTRACT:
Excess solder is removed from an article such as a circuit substrate or electronic component as is often required after separation of a mounted component from a substrate. A metal foil having a surface with micro-roughness is brought in contact with the solder material and heated to thereby melt the solder, allowing it to flow onto the foil surface. The foil, having the molten solder therein, is then withdrawn.

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