Michael M. Sopira

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Method of batch-fabricating flip-chip bonded dual integrated cir

Metal working – Method of mechanical manufacture – Assembling or joining
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Radiant energy sensor

Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
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Self-aligned, flip-chip focal plane array configuration

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Profile ID: LFUS-PAI-P-276615

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