Method of batch-fabricating flip-chip bonded dual integrated cir

Details Method of batch-fabricating flip-chip bonded dual integrated cir Method of batch-fabricating flip-chip bonded dual integrated cir

1982-09-29

1983-11-22

Ozaki, G.

Metal working

Method of mechanical manufacture

Assembling or joining

29576J, 29577R, 29583, 29589, H01L 2128

Patent

active

044160542

ABSTRACT:
A focal plane array including a first integrated circuit for infrared radiation (IR) detection and a second integrated circuit for signal processing is assembled in a flip-chip structural configuration. Each integrated circuit includes an array of metallic contacts on a surface thereof for interconnection in the flip-chip arrangement. The contact array of the IR detector includes a substantially greater number of contacts than the contact array of the signal processor. Consequently, it is not a prerequisite to precisely align the two integrated circuits in a one-to-one contact relationship for the flip-chip bonding operation therebetween. Thus, each metallic contact of the signal processor may be roughly aligned and bonded to a corresponding group of metallic contacts of the IR detector array without altering significantly the operation of the overall focal plane array as long as at least one metallic contact of the IR detector array is included in each corresponding contact group. As a result of this structural improvement, a method of batch-fabricating a plurality of high-density focal plane arrays may be accomplished quite expeditiously.

REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 3913216 (1975-10-01), Ballonoff
patent: 4067104 (1978-01-01), Tracy
patent: 4100672 (1978-07-01), King et al.
patent: 4127863 (1978-11-01), Kurata
patent: 4142925 (1979-03-01), King et al.
patent: 4190851 (1980-02-01), Finnila et al.
patent: 4197633 (1980-04-01), Lorenze et al.
patent: 4206470 (1980-06-01), White
patent: 4369458 (1983-01-01), Thomas et al.

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