Self-aligned, flip-chip focal plane array configuration

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357 40, 357 65, 357 24, H01L 2978, H01L 2714, H01L 2702, H01L 2348

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active

043694586

ABSTRACT:
A focal plane array including a first integrated circuit for infrared radiation (IR) detection and a second integrated circuit for signal processing is assembled in a flip-chip structural configuration. Each integrated circuit includes an array of metallic contacts on a surface thereof for interconnection in the flip-chip arrangement. The contact array of the IR detector includes a substantially greater number of contacts than the contact array of the signal processor. Consequently, it is not a prerequisite to precisely align the two integrated circuits in a one-to-one contact relationship for the flip-chip bonding operation therebetween. Thus, each metallic contact of the signal processor may be roughly aligned and bonded to a corresponding group of metallic contacts of the IR detector array without altering significantly the operation of the overall focal plane array as long as at least one metallic contact of the IR detector array is included in each corresponding contact group. As a result of this structural improvement, a method of batch-fabricating a plurality of high-density focal plane arrays may be accomplished quite expeditiously.

REFERENCES:
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patent: 3871015 (1975-03-01), Lin et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4127863 (1978-11-01), Kurata
patent: 4190851 (1980-02-01), Finnila et al.
patent: 4206470 (1980-06-01), White
patent: 4321614 (1982-03-01), Blazer et al.
H. Levinstern, "Infrared Detectors", Physics Today, Nov. 1977, pp. 23-28.

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