Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
Inventor
active
Flip-chip package with underfill having low density filler
Flip-chip package with underfill having low density filler
Packaging integrated circuits with adhesive posts
SMT passive device noflow underfill methodology and structure
SMT passive device noflow underfill methodology and structure
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Profile ID: LFUS-PAI-P-2689062