4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. With means applying wave energy or electrical energy...

Michael Anthony Gaynes

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Apparatus and methods for high-performance liquid cooling of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Apparatus for attaching heat sinks directly to chip carrier modu

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent

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Attaching heat sinks directly to flip chips and ceramic chip car

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Attaching heat sinks directly to flip chips and ceramic chip car

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Attaching heat sinks directly to flip chips and ceramic chip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-51663

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