4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Michael A. Stadt

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Sockets for "springed" semiconductor devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent

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Sockets for “springed” semiconductor devices

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Sockets for “springed” semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Sockets for “springed” semiconductor devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Sockets for “springed” semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-580896

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