Sockets for "springed" semiconductor devices

Details Sockets for "springed" semiconductor devices Sockets for "springed" semiconductor devices

1998-06-30

2000-03-07

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

438455, 438464, 438667, H01L 2144, H01L 2148, H01L 2150

Patent

active

060339357

ABSTRACT:
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

REFERENCES:
patent: 5897236 (1999-04-01), Eldridge et al.
patent: 5917707 (1999-06-01), Khandros et al.

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