Sockets for “springed” semiconductor devices

Details Sockets for “springed” semiconductor devices Sockets for “springed” semiconductor devices

2006-06-13

2006-06-13

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S831000, C029S837000, C029S838000, C029S842000, C029S739000, C029S741000, C439S081000, C439S816000, C438S117000, C438S455000, C438S464000, C438S667000, C361S769000

Reexamination Certificate

active

07059047

ABSTRACT:
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

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