4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
  6. By partial or total immersion of work or applicator into liquid

Matthias F. Comerford

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Method and apparatus for mass soldering with subsequent reflow s

Metal fusion bonding – Process – With condition responsive – program – or timing control
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Preheater for use in mass soldering apparatus

Electric heating – Heating devices – Combined with container – enclosure – or support for material...
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Wave soldering system

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
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Profile ID: LFUS-PAI-P-700571

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