Wave soldering system

Details Wave soldering system Wave soldering system

1978-08-18

1980-06-17

Crane, Daniel C.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

B23K 306

Patent

active

042080029

ABSTRACT:
A mass wave soldering apparatus is described. The apparatus comprises a sump having upwardly diagonally extending front and rear walls, and a pair of vertical end walls which cooperate to form an upwardly extending open ended nozzle chamber of increasing plan area. A Z-shaped baffle screen is positioned within the nozzle chamber and distributes the molten solder pumped upwardly in the sump as a wide, smooth substantially unidirectional solder wave ideally contoured for high-speed production soldering.

REFERENCES:
patent: 3398873 (1968-08-01), Wegener et al.
patent: 3726465 (1973-04-01), Boynton et al.
patent: 3773242 (1973-11-01), Fitzsimmons
patent: 3930465 (1976-01-01), Schuierer
patent: 3989180 (1976-11-01), Tardoskegyi

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