Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1985-02-21
1986-07-15
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228175, 2281801, 2281802, 228187, B23K 3102
Patent
active
046001379
ABSTRACT:
An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering station first, and after a timed interval the circuit boards pass through a solder reflow station. The timed interval allows heat transfer through the circuit boards to reach its maximum.
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IBM Technical Disclosure Bulletin, vol. 20, No. 7, Dec. 1977.
Godici Nicholas P.
Heinrich Samuel M.
Hollis Automation, Inc.
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