4. Plants
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Masao Kanno

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Circuit boards using heat resistant resin for adhesive layers

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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High-density wired circuit board using insulated wires

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Patent

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Osteospermum plant named ‘Kakegawa AU1’

Plants – Herbaceous ornamnental flowering plant – Osteospermum
Plant Patent

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Osteospermum plant named ‘Kakegawa AU2’

Plants – Herbaceous ornamnental flowering plant – Osteospermum
Plant Patent

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Osteospermum plant named ‘Kakegawa AU3’

Plants – Herbaceous ornamnental flowering plant – Osteospermum
Plant Patent

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Profile ID: LFUS-PAI-P-168615

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