High-density wired circuit board using insulated wires

Details High-density wired circuit board using insulated wires High-density wired circuit board using insulated wires

1987-03-31

1988-12-13

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29831, 361416, H05K 100, H05K 300

Patent

active

047912383

ABSTRACT:
A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.

REFERENCES:
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 3895181 (1975-07-01), La Grange et al.
patent: 3969816 (1976-07-01), Swengel, Sr. et al.
patent: 4298770 (1981-11-01), Nishihara et al.
patent: 4554405 (1985-11-01), Varker

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