Circuit boards using heat resistant resin for adhesive layers

Details Circuit boards using heat resistant resin for adhesive layers Circuit boards using heat resistant resin for adhesive layers

1997-10-23

2000-09-19

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174266, 428209, 428901, H05K 103

Patent

active

061215538

ABSTRACT:
An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

REFERENCES:
patent: 5403869 (1995-04-01), Arike et al.
patent: 5486655 (1996-01-01), Arike et al.
patent: 5622588 (1997-04-01), Weber
patent: 5625166 (1997-04-01), Natarajan
patent: 5650593 (1997-07-01), McMillan et al.

Affiliated with

Also associated with

Rating

Circuit boards using heat resistant resin for adhesive layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit boards using heat resistant resin for adhesive layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit boards using heat resistant resin for adhesive layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1075341