Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1996-04-26
1998-01-13
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, H01L 23495
Patent
active
057082952
ABSTRACT:
In a space surrounded by outer frames formed in the shape of as rectangle is disposed a die pad in the shape of a square for mounting a semiconductor chip having electrodes. Each of the outer frames is connected with a plurality of outer leads respectively continuous with inner leads which are used for electrical connection and extended toward the die pad. Each inner lead is extended to the vicinity of a position where each electrode of the semiconductor chip is to be formed. The corners of the die pad are respectively provided with support members extending to positions away from a dam bar by a predetermined distance. The support members are connected with the inner leads via a square ring-shaped insulating member. Thus, the die pad is supported by the outer frames via the support members. Since there is no need to provide a die pad lead, the space at the corner conventionally occupied by the die pad lead can be utilized for wiring, and the leads can be easily led in.
REFERENCES:
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5457341 (1995-10-01), West
Minamio Masanori
Nomura Toru
Oga Akira
Yamaguchi Yukio
Jackson Jerome
Kelley Nathan K.
Matsushita Electronics Corporation
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