Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Apparatus for forming a double-bump structure used for flip-chip
Chip size package semiconductor device and method of forming...
Chip size package semiconductor device and method of forming...
Compact semiconductor device capable of mounting a plurality...
Compact semiconductor device capable of mounting a plurality...
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Profile ID: LFUS-PAI-P-538808