Apparatus for forming a double-bump structure used for flip-chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257778, 257738, H01L 2160, H01L 2946

Patent

active

055085610

ABSTRACT:
A bump structure has a bump constituted by a metal projection which is formed on an electrode of a substrate, and a solder which covers the metal projection but does not touch the electrode. The metal projection is substantially spherical and has a projected portion at a center portion on an upper surface thereof. The metal projection is made of a metal having properties of solder diffusion prevention and adhesion to solder. The bump structure may have two bumps, the first bump being substantially the same as the bump described above and the second being such that its diameter is smaller than an outer diameter of the first bump and it covers the projected portion on the first bump. This bump structure can be formed using a simple process, and can be applied to flip-chip mounting in semiconductor devices with high reliability and yield.

REFERENCES:
patent: 4000842 (1977-01-01), Burns
patent: 4263606 (1981-04-01), Yorikane
patent: 4742023 (1988-05-01), Hasegawa
patent: 4818728 (1989-04-01), Rai et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5289631 (1994-03-01), Koopman et al.
Y. Tomura et al., "Chip-On-Board Mounting Technology Using Stud-Bump-Bonding Technique", National Technical Report, vol. 39, No. 2, Apr. 1993, pp. 90-97.
"Flip Chip Mounting Using Stud Bumps and Adhesives for Encapsulation", Fujitsu, vol. 43, No. 7, Nov. 1992, pp. 773-778 with English-Language Abstract.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for forming a double-bump structure used for flip-chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming a double-bump structure used for flip-chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming a double-bump structure used for flip-chip will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-327341

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.