Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-01-18
2005-01-18
Zarneke, David A. (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Reexamination Certificate
active
06844619
ABSTRACT:
In a semiconductor device, rewirings3for connecting a semiconductor chip1a, a semiconductor chip1band external connecting terminals4with each other are formed on the semiconductor chip1a. An insulating resin6having opening portions in regions for forming the external connecting terminals4at peripheral portion of the semiconductor chip1aand another opening portions in another region for mounting the semiconductor chip1bat the central of the semiconductor chip1ais overlaid on the rewirings3. The external connecting terminals4consisting of BGA are formed in the opening portions of the regions for forming the external connecting terminals4through lands5. The semiconductor chip1bis connected to another opening portions of another region for mounting the semiconductor chip1bby flip-chip structure through electrodes11and bumps8. A junction surface of the bumps8is sealed by a sealing resin7. The semiconductor chip1bis mounted on the same surface as that the external connecting terminals4are formed. The under surface of the semiconductor chip1bis ground in order that the semiconductor chip1bmay be shorter than the external connecting terminals4. The semiconductor chip1bis thereby mounted with high density.
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NEC Corporation
Sughrue & Mion, PLLC
Zarneke David A.
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