4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
  6. Gaseous flux

Masahumi Wada

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Reflow soldering apparatus

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent

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Reflow soldering method and system therefor

Metal fusion bonding – Process – With condition responsive – program – or timing control
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Profile ID: LFUS-PAI-P-1282932

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