Reflow soldering method and system therefor

Details Reflow soldering method and system therefor Reflow soldering method and system therefor

1992-03-25

1993-04-20

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228232, 228 9, 219388, 432152, B23K 100, B23K 1012

Patent

active

052034879

ABSTRACT:
In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.

REFERENCES:
patent: 4775776 (1988-10-01), Rahn et al.
patent: 4832249 (1989-05-01), Ehler
patent: 4876437 (1989-10-01), Kondo
patent: 4909430 (1990-03-01), Yokota
patent: 5039841 (1991-08-01), Kato et al.
patent: 5069380 (1991-12-01), Deambrosio

Affiliated with

Also associated with

Rating

Reflow soldering method and system therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reflow soldering method and system therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reflow soldering method and system therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1520026