Reflow soldering apparatus

Details Reflow soldering apparatus Reflow soldering apparatus

1990-10-02

1992-11-17

Seidel, Richard K.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

228232, 2281801, 219388, B23K 100, F27B 906

Patent

active

051635992

ABSTRACT:
A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.

REFERENCES:
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4664308 (1987-05-01), Boynton
patent: 4771929 (1988-09-01), Bahr et al.
patent: 4876437 (1989-10-01), Kondo
patent: 4938410 (1990-07-01), Kondo

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